With recent advances in packaging technology, it is possible to connect multiple dies on a single package. OpenFive's D2D Controller provides end to end connection from one die to another. In this webinar, we will review the trade-offs between various connectivity options. We will also review the application of D2D in Chiplets and HPC to meet the designers' latency and power targets.
Die-to-Die connectivity, various package options
Who should attend?:
Designers, Architects, Marketing, Package engineers
Sr. Director of SoC IP Product Marketing
As the Director of SoC IP Product Marketing at SiFive, Ketan Mehta is responsible for Interlaken, Ethernet, HBM memory and other high-speed interfaces. With over 25 years of experience in engineering and product planning, Ketan has a rich background in IP connectivity solutions for various applications including networking, storage, data center and cloud. He received his M.S. degree in electrical engineering from The University of Texas at San Antonio, and his MBA from San Jose State University.
OpenFive is a solution-centric silicon company that is uniquely positioned to design processor agnostic SoC architectures.
With customizable and differentiated IP for Artificial Intelligence, Edge Computing, HPC, and Networking solutions, OpenFive develops domain-specific SoC architectures based on high-performance, highly-efficient, cost-optimized IP to deliver scalable, optimized, differentiated silicon.
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